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US Patent Issued to Adeia Semiconductor Bonding Technologies on July 28 for "Heterogeneous annealing method and device" (North Carolina Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,818, issued on July 28, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Heterogeneous annealing method a... Read More


US Patent Issued to FUJI ELECTRIC on July 28 for "Electronic device and electronic device manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,819, issued on July 28, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Electronic device and electronic device manufacturing me... Read More


US Patent Issued to SILICON BOX on July 28 for "Method of manufacturing fan-out packaging device and fan-out packaging device manufactured thereby" (Nevada Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,820, issued on July 28, was assigned to SILICON BOX PTE. LTD. (Singapore). "Method of manufacturing fan-out packaging device and fan-out pa... Read More


US Patent Issued to ROHM on July 28 for "Semiconductor equipment" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,821, issued on July 28, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor equipment" was invented by Moe Yamaguchi (Kyoto, Japan... Read More


US Patent Issued to Mitsubishi Electric on July 28 for "Power conversion device and manufacturing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,822, issued on July 28, was assigned to Mitsubishi Electric Corp. (Tokyo). "Power conversion device and manufacturing method therefor" was ... Read More


US Patent Issued to Mitsubishi Electric on July 28 for "Semiconductor apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,823, issued on July 28, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor apparatus" was invented by Mamoru Togami (Tokyo),... Read More


US Patent Issued to Infineon Technologies Austria on July 28 for "Surface mount package having an internal redundant electrical connection" (German, Austrian Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,824, issued on July 28, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Surface mount package having an internal redu... Read More


US Patent Issued to DENSO on July 28 for "Semiconductor device and method for manufacturing the semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,825, issued on July 28, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device and method for manufacturing the semiconduc... Read More


US Patent Issued to Tokyo Electron on July 28 for "Systems and methods for bonding semiconductor devices" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,826, issued on July 28, was assigned to Tokyo Electron Ltd. (Tokyo). "Systems and methods for bonding semiconductor devices" was invented b... Read More


US TRADEMARK: LITTLE JOURNEY

ALEXANDRIA, Va., July 28 -- The United States Patent and Trademark Office (USPTO) published about the trademark 'LITTLE JOURNEY' in its latest official gazette. The trademark application with the seri... Read More